SCEN103 -- Lithography

Stages of Diffusion Doping

• Preparation of Substrate
  • Select Silicon Substrate
  • Add Oxide Layer
  • Add Photoresist Layer
  • Select Pattern Mask
  • Ready for Exposure
• Exposure of the Photoresist
  • Expose to Ultraviolet Light
  • Exposed Photoresist is Hardened
• Patterning of the Photoresist
  • Prepare for Etching
  • Expose to Photoresist Solvent
  • Remove Unhardened Photoresist
• Etching of the Oxide Layer
  • Expose to Hydrofluoric Acid
  • Remove Exposed Oxide
  • Remove Hardened Photoresist
• Diffusion Doping
  • Expose to Dopant
  • Dopant Successfully Implanted
  • Remove Oxide Layer
  • Feature Successfully Created
• Preparation for Next Feature
  • Add Oxide Layer to Continue

Additional references regarding lithography:

• How Chips Are Made from the Education Programs at Intel
• Microelectronics 101 at IBM Microelectronics
• The Semiconducting Manufacturing Process by Fullman-Kinetics
• How RAM Works and Semiconductor History from Micron Technology

• Fabrication of pn diode, from Education Applets in Solid State Materials,
  Center for Active Learning of Microelctronics and Photonics at SUNY Buffalo
• Ion Beam Implantation, list of links from Case Technology
• Semiconductor Manufacturing 101 from Red Herring

• The Semiconductor Reference Site
• On a ligher note: Silicon Zoo -- thanks to Jeremy Liebman for suggesting this site.

"http://www.physics.udel.edu/~watson/scen103/litho/"
Last updated May 21, 2001.
Copyright George Watson, Univ. of Delaware, 1996.